ITO Process Analysis

Manufacturing intelligence

ITO 制程分析
从参数到良率

以批次、设备与工艺参数定位良率损失，并将异常追溯到具体制程节点。

查看分析
ITO110 nm coating

示例数据，最近更新 09:30

Overall yield94.7%+1.8% vs. previous
Sheet resistance14.6 Ω/□目标 13.5-15.5 Ω/□
Transmittance91.2%550 nm wavelength
Process capability1.42 Cpk稳定受控

制程路径

选择节点查看当前工艺窗口与设备状态。

良率与缺陷定位

所有数值均为演示数据，可替换为实际 MES、SPC 或 Excel 数据。

批次良率趋势

控制线与目标线对照

缺陷 Pareto

按影响片数排序

膜阻均匀性

SP-02 腔体内玻璃基板测点

KEY FINDING

颗粒缺陷集中于 SP-02

SP-02 贡献了 43% 的颗粒缺陷，腔体清洁后首批风险最高。

相关参数
Base pressure
影响批次
7 lots
建议动作
调整 seasoning recipe

项目证据

以下数据与改善结果均来自模拟场景。

12,480制程记录
860生产批次
8生产设备
7制程节点
6缺陷类型
SIMULATED

模拟改善结果

Overall yield92.8%95.1%+2.3 pp
Defect rate4.6%2.9%-37%
Process Cpk1.081.42+0.34
定位时间120 min35 min-71%

Resume-ready summary

  • Developed a responsive ITO process-analysis application using 12,480 simulated manufacturing records.
  • Implemented yield trending, defect Pareto, process capability monitoring, and resistance heatmaps.
  • Reduced the simulated analysis path from 11 interactions to 4.